| 摘要 |
<p>The present invention relates to a wafer grinding device with an enhanced structure to prevent scratches and cracks on the surface of a wafer. The wafer grinding device according to the present invention includes a chuck table which is installed to be able to rotate and has a wafer thereon; a spindle which is installed on the upper side of the chuck table to be able to rotate; and a grinding wheel which is coupled to the lower end of the spindle and grinds the wafer. The grinding wheel includes a wheel body which is coupled to the lower end of the spindle and grinding tips which are coupled to the wheel body in the circumferential direction and grind the wafer by being in contact with the wafer. The lower end of the grinding tip becomes thinner from the upper side to the lower side.</p> |
