| 摘要 |
[Problem] Provided is a many-up wiring substrate for manufacturing a small wiring board capable of satisfactorily realizing bonding with the wiring of the external circuit board. [Solution] A many-up wiring substrate includes an insulating base substrate in which a plurality of wiring board regions (1a) are arranged in at least one of a vertical direction and a horizontal direction; a hole (1c) disposed in one main surface of the insulating base substrate, and straddling adjacent wiring board regions (1a) of the plurality of wiring board regions or straddling the wiring board regions (1a) and a dummy region (1b); a conductor (3) disposed on an inner surface of the hole (1c); and a through hole (1d) disposed so as to extend from the inner surface of the hole (1c) of the wiring board regions (1a) to the other main surface of the insulating base substrate. Accordingly, since it is possible to form a plating coating on a surface of the conductor (3) disposed on an inner surface of the hole (1c) to a predetermined thickness, it is possible to realize satisfactory bonding with the wiring of the external circuit board when dividing and using such a hole (1c) as castellation. |
