| 摘要 |
<p>The present invention relates to a cleaning apparatus comprising: a collection cup; a wafer driving unit positioned within the collection cup and rotating a wafer; a multi-phase fluid spray unit spraying a multi-phase fluid including steam to the wafer; a cylindrical chamber housing which prevents the multi-phase fluid sprayed on the wafer from leaking to the outside by covering the collection cup; and an exhausting unit communicated with the cylindrical chamber housing and discharging the multi-phase fluid sprayed in the cylindrical chamber housing to the outside. According to the present invention, use of cleaning liquid such as an alkali cleaning liquid, an acid cleaning liquid, and the like can be prevented or minimized when cleaning the wafer. Moreover, the multi-phase fluid sprayed on the wafer does not remain inside the chamber and is rapidly discharged to the outside when spraying the multi-phase fluid including the steam to the wafer positioned within the chamber housing.</p> |
