| 摘要 |
The present invention relates to a manufacturing method of a wafer level package with a heat spreader and, more specifically, to a wafer level package with a heat spreader and a manufacturing method thereof. The wafer level package can improve the heat radiating effects of an existing embedded wafer level package (eWLP) and can improve heat radiating effects by forming a thermal via which emits heat by touching the heat spreader with a redistribution substrate. |
