AN ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND AN ADHESIVE FILM FOR SEMICONDUCTOR PREPARED FROM THE COMPOSITION

摘要

The present invention relates to an adhesive composition for a semiconductor capable of maximizing the operation efficiency of a semiconductor device during a semiconductor process or after the process by markedly reducing the mobility of metal by oxidizing or reducing metal ions or being combined to metal ions by including a ring compound represented by chemical formula 1 as an ion scavenger; and to an adhesive film using the same.