PHOTOSENSITIVE RESIN COMPOSITION, CURED COATING FILM OF THE SAME, AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition showing good finger-touch drying property and excellent electroless gold plating resistance, developability and glossiness of a cured product, and to provide a cured coating film of the composition and a printed wiring board including the cured coating film.SOLUTION: The photosensitive resin composition comprises (A) an acid-modified photosensitive epoxy resin and (B) a non-photosensitive carboxylic acid resin having a styrene skeleton and a weight average molecular weight of 10000 to 50000. It is preferable that the (B) non-photosensitive carboxylic acid resin has an acid value of 120 mgKOH/g or more.