| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck which can obtain high dielectric strength voltage against discharge in a gas introduction path or which can perform temperature control on an adsorption object with high uniformity in wafer temperature.SOLUTION: An electrostatic chuck comprises: a ceramic dielectric substrate having a first principal surface for mounting an adsorption object, a second principal surface on the side opposite to the first principal surface and a through hole provided across from the second principal surface to the first principal surface; a metal base plate which supports the ceramic dielectric substrate and has a gas introduction path connected to the through hole; and an insulator plug having a ceramic porous body provided in the gas introduction path, and a ceramic insulation film which is provided between the ceramic porous body and the gas introduction path and is denser than the ceramic porous body. The ceramic insulation film digs from a surface of the ceramic porous body into the inside of the ceramic porous body. |
