SEMICONDUCTOR DEVICE WITH SOLDER, MOUNTED SEMICONDUCTOR DEVICE WITH SOLDER, AND METHODS OF MANUFACTURING AND MOUNTING SEMICONDUCTOR DEVICE WITH SOLDER

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device with solder capable of being mounted by the solder without reducing characteristics of the semiconductor device, in a semiconductor device with solder including a Schottky electrode, a pad electrode arranged on the Schottky electrode, and a solder arranged on the pad electrode.SOLUTION: A semiconductor device 1 with solder includes a semiconductor device 1D having: a substrate 10; at least one group-III nitride semiconductor layer 20 arranged on the substrate 10; a Schottky electrode 40 arranged on the group-III nitride semiconductor layer 20; and a pad electrode 50 arranged on the Schottky electrode 40. The pad electrode 50 has a multilayer structure at least including a Pt layer. The semiconductor device 1 with solder further includes a solder 60 arranged on the pad electrode 50 of the semiconductor device 1D and having a melting point of 200°C or more and 230°C or less.