发明名称 OPTICAL SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an optical semiconductor device manufacturing method which can easily manage an encapsulation layer before a C stage of encapsulating an optical semiconductor element and improve manufacturing efficiency of an optical semiconductor device.SOLUTION: A manufacturing method of an LED device 5 of manufacturing the LED device 5 by encapsulating an LED 4 by an encapsulation sheet 1 comprises a sheet manufacturing process of manufacturing the encapsulation sheet 1 and an encapsulation process of encapsulating the LED 4 with the encapsulation sheet 1. A time T from manufacturing of the encapsulation sheet 1 in the sheet manufacturing process to encapsulating the LED 4 with the encapsulation sheet 1 in the encapsulation process is within 24 hours.
申请公布号 JP2014209545(A) 申请公布日期 2014.11.06
申请号 JP20130262495 申请日期 2013.12.19
申请人 NITTO DENKO CORP 发明人 NINOMIYA AKIHITO;ITO HISATAKA;OYABU KYOYA;UMETANI EIHIRO;MITANI MUNEHISA
分类号 H01L33/52;H01L21/56 主分类号 H01L33/52
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