发明名称 |
OPTICAL SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device manufacturing method which can easily manage an encapsulation layer before a C stage of encapsulating an optical semiconductor element and improve manufacturing efficiency of an optical semiconductor device.SOLUTION: A manufacturing method of an LED device 5 of manufacturing the LED device 5 by encapsulating an LED 4 by an encapsulation sheet 1 comprises a sheet manufacturing process of manufacturing the encapsulation sheet 1 and an encapsulation process of encapsulating the LED 4 with the encapsulation sheet 1. A time T from manufacturing of the encapsulation sheet 1 in the sheet manufacturing process to encapsulating the LED 4 with the encapsulation sheet 1 in the encapsulation process is within 24 hours. |
申请公布号 |
JP2014209545(A) |
申请公布日期 |
2014.11.06 |
申请号 |
JP20130262495 |
申请日期 |
2013.12.19 |
申请人 |
NITTO DENKO CORP |
发明人 |
NINOMIYA AKIHITO;ITO HISATAKA;OYABU KYOYA;UMETANI EIHIRO;MITANI MUNEHISA |
分类号 |
H01L33/52;H01L21/56 |
主分类号 |
H01L33/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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