发明名称 Semiconductor Device with an Electrode Buried in a Cavity
摘要 A semiconductor device with a buried electrode is manufactured by forming a cavity within a semiconductor substrate, forming an active device region in an epitaxial layer disposed on the semiconductor substrate and forming the buried electrode below the active device region in the cavity. The buried electrode is formed from an electrically conductive material different than the material of the semiconductor substrate.
申请公布号 US2014327103(A1) 申请公布日期 2014.11.06
申请号 US201414332438 申请日期 2014.07.16
申请人 Infineon Technologies Austria AG 发明人 Ahrens Carsten;Baumgartl Johannes;Santos Rodriguez Francisco Javier;Schulze Hans-Joachim
分类号 H01L29/41;H01L21/28 主分类号 H01L29/41
代理机构 代理人
主权项 1. A semiconductor device, comprising: an active device region formed in an epitaxial layer disposed on a semiconductor substrate; and a buried electrode disposed below the active device region in a cavity formed within the semiconductor substrate, the buried electrode comprising an electrically conductive material different than the material of the semiconductor substrate.
地址 Villach AT