发明名称 |
BONDING STRUCTURE OF DIAPHRAGM FOR MICROSPEAKER |
摘要 |
<p>The present invention relates to an assembly structure of the diaphragm of a microspeaker. The present invention provides a diaphragm attaching structure of the microspeaker, which includes a suspension which includes a center part, an outer circumferential part, and a connection part which connects the center part to the outer part; and a side diaphragm which includes an inner circumferential part and an outer circumferential part which are attached to the center part and the outer part of the suspension and includes a dome part which protrudes between the inner circumferential part and the outer circumferential part. The suspension and the side diaphragm are attached by a thermal compression.</p> |
申请公布号 |
KR20140128483(A) |
申请公布日期 |
2014.11.06 |
申请号 |
KR20130046102 |
申请日期 |
2013.04.25 |
申请人 |
EM-TECH CO., LTD. |
发明人 |
KWON, JOONG HAK;KIM, JI HOON;LEE, JUNG HYUNG;OH, HYEON TAEK |
分类号 |
H04R7/16;H04R9/02 |
主分类号 |
H04R7/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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