发明名称 BONDING STRUCTURE OF DIAPHRAGM FOR MICROSPEAKER
摘要 <p>The present invention relates to an assembly structure of the diaphragm of a microspeaker. The present invention provides a diaphragm attaching structure of the microspeaker, which includes a suspension which includes a center part, an outer circumferential part, and a connection part which connects the center part to the outer part; and a side diaphragm which includes an inner circumferential part and an outer circumferential part which are attached to the center part and the outer part of the suspension and includes a dome part which protrudes between the inner circumferential part and the outer circumferential part. The suspension and the side diaphragm are attached by a thermal compression.</p>
申请公布号 KR20140128483(A) 申请公布日期 2014.11.06
申请号 KR20130046102 申请日期 2013.04.25
申请人 EM-TECH CO., LTD. 发明人 KWON, JOONG HAK;KIM, JI HOON;LEE, JUNG HYUNG;OH, HYEON TAEK
分类号 H04R7/16;H04R9/02 主分类号 H04R7/16
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