| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing manufacturing cost.SOLUTION: A semiconductor device 1A has a principal surface 101A and a recess 105A recessed from the principal surface 101A. In addition, the semiconductor device includes: a substrate 100A formed of a semiconductor material; a wiring layer 200A formed on the substrate 100A; azimuth sensor elements 311A, 312A, and 313A housed in the recess 105A; and a sealing resin 400A that covers at least part of the azimuth sensor elements 311A, 312A, and 313A. |
