| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition showing good finger-touch drying property and excellent electroless gold plating resistance, developability and glossiness of a cured product, to provide a cured coating film of the composition and a printed wiring board including the cured coating film, and to provide the photosensitive resin composition having good sensitivity and excellent in suppressing decrease in the reflectance and discoloration of the cured product due to gold plating, heat or irradiation with light, and the cured coating film of the composition and a printed wiring board including the cured product.SOLUTION: The photosensitive resin composition comprises (A) an acid-modified photosensitive epoxy resin and (B) a non-photosensitive carboxylic acid resin having a styrene skeleton and a weight average molecular weight of 10000 to 50000. It is preferable that the (B) non-photosensitive carboxylic acid resin has an acid value of 120 mgKOH/g or more. The photosensitive resin composition comprises (α) an acid-modified photosensitive resin, (β) a non-photosensitive carboxylic acid having a styrene skeleton, and (γ) a colorant.</p> |
