发明名称 HOLLOW SEALING RESIN SHEET AND METHOD FOR MANUFACTURING HOLLOW PACKAGE
摘要 <p>PROBLEM TO BE SOLVED: To provide a hollow sealing resin sheet that can be used to manufacture a hollow package with high yield even if the width of air gap of a hollow structure is approximately 100μm, and a method for manufacturing the hollow package.SOLUTION: A hollow sealing resin sheet contains an inorganic filler with a content of 70 vol.% or more and 90 vol.% or less. In a grain size distribution of the inorganic filler measured by the laser diffraction scatter method, at least one of a peak of frequent distribution exists in a particle size range of equal to or more than 1μm and equal to or less than 10μm, and at least one of peak of frequent distribution exists in a particle size range of more than 10μm and equal to or less than 100μm, and a BET specific surface area of the inorganic filler is equal to or more than 2 m/g and equal to or less than 5 m/g.</p>
申请公布号 JP2014209567(A) 申请公布日期 2014.11.06
申请号 JP20140022306 申请日期 2014.02.07
申请人 NITTO DENKO CORP 发明人 TOYODA HIDESHI;SHIMIZU YUSAKU;ISHIZAKA TAKESHI;ISHII ATSUSHI
分类号 H01L23/08 主分类号 H01L23/08
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