THREE-DIMENSIONAL PACKAGING SEMICONDUCTOR DEVICE, RESIN COMPOSITION AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a three-dimensional packaging semiconductor device having high performance.SOLUTION: A three-dimensional packaging semiconductor device comprises two and more semiconductor devices arranged at a distance of 30μm and under between the closest parts; and a heat transfer interposed material interposed between the semiconductor devices. The heat transfer interposed material has silica particles and a resin material in which the silica particles are dispersed, in which a contained amount of each of uranium and thorium in the silica particles is 1.0 ppb and under, a contained amount of each of natrium and kalium is 500 ppm and under, and a mean volume diameter of the silica particles is within a range of 2 nm-200 nm, and a real density is 2.1 g/cmand over.