CHEMICAL MECHANICAL PLANARIZATION SLURRY COMPOSITION COMPRISING COMPOSITE PARTICLES, PROCESS FOR REMOVING MATERIAL USING SAID COMPOSITION, CMP POLISHING PAD AND PROCESS FOR PREPARING SAID COMPOSITION

摘要

CMP processes, tools and slurries utilize composite particles that include core particles having organosilica particles disposed about the core particles. Using these processes, tools and slurries can enhance removal rates, reduce defectivity and increase cleanability with respect to comparable systems and substrates.