发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device having stable electrical characteristics, and to provide a method of manufacturing the semiconductor device.SOLUTION: A method of manufacturing a semiconductor device comprises the steps of: forming a first source electrode in contact with a semiconductor layer; forming a first drain electrode in contact with the semiconductor layer; forming a second source electrode in contact with the semiconductor layer, extending over an end of the first source electrode; forming a second drain electrode in contact with the semiconductor layer, extending over an end of the first drain electrode; forming a first side wall in contact with a side wall of the second source electrode and the semiconductor layer; forming a second side wall in contact with a side wall of the second drain electrode and the semiconductor layer; and forming a gate electrode through a gate insulation layer so as to overlap with the first side wall, the second side wall, and the semiconductor layer. An electric field near the source electrode or the drain electrode is relaxed and hot carrier deterioration hardly occurs by providing the first side wall and the second side wall.
申请公布号 JP2014209596(A) 申请公布日期 2014.11.06
申请号 JP20140055989 申请日期 2014.03.19
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI;MATSUBAYASHI DAISUKE
分类号 H01L29/786;C23C14/08;G09F9/30;H01L21/336;H01L21/8242;H01L27/10;H01L27/105;H01L27/108 主分类号 H01L29/786
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