发明名称 |
SYSTEM AND METHOD FOR MULTI-POINT HSDPA COMMUNICATION UTILIZING MULTI-LINK RLC SUBLAYER |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and apparatus for wireless communication which provides a system and method for Multi-Point HSDPA communication utilizing a multi-link RLC sublayer.SOLUTION: The invention provides a multi-link RLC sublayer in an RNC 802 capable of allocating RLC PDUs among a plurality of MAC entities 804, 806 for use in a Multi-Point HSDPA network. The invention addresses issues relating to out-of-order delivery of the RLC PDUs to UE 808, such as unnecessary retransmissions. The multi-link RLC sublayer distinguishes between sequence number gaps that are caused by physical layer transmission failures and sequence number gaps caused merely by skew.</p> |
申请公布号 |
JP2014209756(A) |
申请公布日期 |
2014.11.06 |
申请号 |
JP20140120410 |
申请日期 |
2014.06.11 |
申请人 |
QUALCOMM INC |
发明人 |
DAN LE JEAN;SHARAD DEEPAK SAMBHWANI;ROHIT KAPOOR;HOU JILEI;GE WEIYAN |
分类号 |
H04W28/16;H04W28/04;H04W72/04 |
主分类号 |
H04W28/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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