发明名称 SYSTEM AND METHOD FOR MULTI-POINT HSDPA COMMUNICATION UTILIZING MULTI-LINK RLC SUBLAYER
摘要 <p>PROBLEM TO BE SOLVED: To provide a method and apparatus for wireless communication which provides a system and method for Multi-Point HSDPA communication utilizing a multi-link RLC sublayer.SOLUTION: The invention provides a multi-link RLC sublayer in an RNC 802 capable of allocating RLC PDUs among a plurality of MAC entities 804, 806 for use in a Multi-Point HSDPA network. The invention addresses issues relating to out-of-order delivery of the RLC PDUs to UE 808, such as unnecessary retransmissions. The multi-link RLC sublayer distinguishes between sequence number gaps that are caused by physical layer transmission failures and sequence number gaps caused merely by skew.</p>
申请公布号 JP2014209756(A) 申请公布日期 2014.11.06
申请号 JP20140120410 申请日期 2014.06.11
申请人 QUALCOMM INC 发明人 DAN LE JEAN;SHARAD DEEPAK SAMBHWANI;ROHIT KAPOOR;HOU JILEI;GE WEIYAN
分类号 H04W28/16;H04W28/04;H04W72/04 主分类号 H04W28/16
代理机构 代理人
主权项
地址