THROUGH SUBSTRATE VIA STRUCTURES AND METHODS OF FORMING THE SAME

摘要

A structure includes a substrate, and an interconnect structure over the substrate. The structure further includes a through-substrate-via (TSV) extending through the interconnect structure and into the substrate, the TSV comprising a conductive material layer. The structure further includes a dielectric layer having a first portion over the interconnect structure and a second portion within the TSV, wherein the first portion and the second portion comprise a same material. The conductive material layer includes a first section separated from substrate by the second portion of the dielectric layer. The conductive material layer further includes a second section over a top surface of the second portion of the dielectric layer. The conductive material layer further includes a third section over the second section, wherein the third section has a width greater than a width of the second section.

主权项

1. A structure comprising:
a substrate; an interconnect structure over the substrate; a through-substrate-via (TSV) extending through the interconnect structure and into the substrate, the TSV comprising a conductive material layer; and a dielectric layer having a first portion over the interconnect structure and a second portion within the TSV, wherein the first portion and the second portion comprise a same material, wherein the conductive material layer comprises:
a first section separated from substrate by the second portion of the dielectric layer,a second section over a top surface of the second portion of the dielectric layer, anda third section over the second section, wherein the third section has a width greater than a width of the second section.