发明名称 |
THERMAL MANAGEMENT STRUCTURES FOR OPTOELECTRONIC MODULES |
摘要 |
An example embodiment includes optoelectronic module. The optoelectronic module may include a lens assembly, a module board, heat-generating components, and a thermally conductive plate. The lens assembly may be secured to the module board. The module board may include a printed circuit board (PCB). The heat-generating components may be mounted to the PCB. The thermally conductive plate may be secured to a surface of the module board. The thermally conductive plate may define an opening that receives at least a portion of the lens assembly. The thermally conductive plate may be configured to absorb at least a portion of thermal energy generated during operation of the heat-generating components and to transfer the thermal energy away from the heat-generating components. |
申请公布号 |
WO2014179511(A2) |
申请公布日期 |
2014.11.06 |
申请号 |
WO2014US36268 |
申请日期 |
2014.04.30 |
申请人 |
FINISAR CORPORATION |
发明人 |
HSIEH, CINDY, H.;FLENS, FRANK, J.;LIPKIN, ZIV |
分类号 |
G02B6/42 |
主分类号 |
G02B6/42 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|