发明名称 CONTINUOUS PLASMA ETCH PROCESS
摘要 A method for etching features with a continuous plasma is provided. A first plasma process is provided, comprising providing a flow of a first process gas into a process chamber, maintaining the continuous plasma, and stopping the flow of the first process gas into the process chamber. A transition process is provided, comprising providing a flow of a transition gas into the process chamber, maintaining the continuous plasma, and stopping the flow of the transition gas into the process chamber. A second plasma process is provided, comprising providing a flow of a second process gas into the process chamber, maintaining the continuous plasma, and stopping the second process gas into the process chamber.
申请公布号 US2014329391(A1) 申请公布日期 2014.11.06
申请号 US201313875146 申请日期 2013.05.01
申请人 Lam Research Corporation 发明人 Lee Wonchul;Fu Qian
分类号 H01L21/3065 主分类号 H01L21/3065
代理机构 代理人
主权项 1. A method for etching features with a continuous plasma, comprising: providing a first plasma process, comprising: providing a flow of a first process gas into a process chamber;maintaining the continuous plasma; andstopping the flow of the first process gas into the process chamber; providing a transition process, comprising; providing a flow of a transition gas into the process chamber;maintaining the continuous plasma; andstopping the flow of the transition gas into the process chamber; and providing a second plasma process, comprising: providing a flow of a second process gas into the process chamber;maintaining the continuous plasma; andstopping the second process gas into the process chamber.
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