| 发明名称 |
ELECTROPLATING CONTACTS WITH SILVER-ALLOYS IN A BASIC BATH |
| 摘要 |
A method for silver-alloy plating an electrical contact and a silver-alloy plated electrical contact are provided. The method includes cleaning the electrical contact by removing contaminates and exposing the electrical contact to at least one of an acid or base. The method includes preparing a sliver-alloy plating bath including water, a silver complex, and a metal complex, the metal complex being at least one of nickel or cobalt. The method includes silver-alloy plating the electrical contact in the silver-alloy plating bath, wherein the plating bath has a pH of greater than 7. The metal complex forms about 0.3% to about 50% by weight of a content of a silver-alloy plated deposit. |
| 申请公布号 |
US2014326605(A1) |
申请公布日期 |
2014.11.06 |
| 申请号 |
US201313886337 |
申请日期 |
2013.05.03 |
| 申请人 |
TYCO ELECTRONICS CORPORATION |
发明人 |
ZHENG Min;GAZDA Jerzy |
| 分类号 |
C25D3/64;C25D7/00 |
主分类号 |
C25D3/64 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for silver-alloy plating an electrical contact comprising:
cleaning the electrical contact by removing contaminates and exposing the electrical contact to at least one of an acid or base; preparing a sliver-alloy plating bath including water, a silver complex, and a metal complex, the metal complex being at least one of nickel or cobalt; and silver-alloy plating the electrical contact in the silver-alloy plating bath, wherein the plating bath has a pH of greater than 7. |
| 地址 |
Berwyn PA US |
