LEAD FRAME WITH RESIN, METHOD FOR MANUFACTURING THE LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a lead frame with resin and a method for manufacturing the lead frame, which enhance the reflection performance for light from an LED element and improve the luminous efficiency in a semiconductor device, and to provide a semiconductor device and a method for manufacturing the semiconductor device.SOLUTION: The lead frame with resin 10 includes a lead frame 15 and an outer side resin 23 provided on the lead frame 15. The lead frame 15 includes a body part 11 having a placing surface 11a on which an LED element 21 is placed and an Ag plating layer 12, which is provided on the body part 11 and functions as a reflection layer for reflecting light from the LED element 21. The Ag plating layer 12 is composed of an outer side resin corresponding part 16 corresponding to the outer side resin 23 and a sealing resin corresponding part 17 corresponding to a sealing resin 24. The glossiness of the sealing resin corresponding part 17 of the Ag plating layer 12 is higher than the glossiness of the outer side resin corresponding part 16.