发明名称 |
COPPER FOIL WITH A CARRIER, PRINTED WIRING BOARD, COPPER-CLAD LAMINATE, ELECTRONIC APPARATUS AND METHOD FOR PRODUCING PRINTED WIRING BOARD |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a copper foil with a carrier that allows good laser holing of ultra-thin copper layer and is suitable in the preparation of high density integrated circuit board.SOLUTION: A copper foil with a carrier comprising a carrier, an intermediate layer and an ultra-thin copper layer in this order, characterized in that when the copper foil with a carrier is heated at 220°C for 2 hours, followed by peeling off the ultra-thin copper layer in accordance with JIS C6471, the surface roughness Rz on the intermediate layer side of the ultra-thin copper layer measured by a laser microscope is 0.62μm or more and 1.59μm or less and the standard deviation of the surface roughness Rz is 0.51μm or less.</p> |
申请公布号 |
JP2014208909(A) |
申请公布日期 |
2014.11.06 |
申请号 |
JP20140073927 |
申请日期 |
2014.03.31 |
申请人 |
JX NIPPON MINING & METALS CORP |
发明人 |
KOHIKI MICHIYA |
分类号 |
C25D1/04;C25D7/06;H05K1/09;H05K3/20 |
主分类号 |
C25D1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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