发明名称 SILVER-COATED COPPER POWDER, METHOD FOR PRODUCING SILVER-COATED COPPER POWDER, AND RESIN CURING TYPE CONDUCTIVE PASTE
摘要 <p>PROBLEM TO BE SOLVED: To provide a resin curing type conductive paste for obtaining a conductive film which is more inexpensive and has a more excellent conductivity than a conductive film formed by using a resin curing type conductive paste obtained by a conventional method, to provide a silver-coated copper powder to be blended in the resin curing type conductive paste, and to provide a method for producing the silver-coated copper powder.SOLUTION: A silver-coated copper powder is obtained by coating a material silver-coated copper powder with 0.01-0.5 mass% of a polycarboxylic acid. The silver coated copper powder is blended in a resin curing type conductive paste.</p>
申请公布号 JP2014208908(A) 申请公布日期 2014.11.06
申请号 JP20140068091 申请日期 2014.03.28
申请人 DOWA ELECTRONICS MATERIALS CO LTD 发明人 YAMADA YUICHI;NAGAHARA AIKO;NOGAMI TOKUAKI;FUJINO TAKEAKI
分类号 B22F1/02;B22F1/00;B22F9/00;H01B1/00;H01B1/22;H01B5/00;H01B13/00 主分类号 B22F1/02
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