发明名称 |
SILVER-COATED COPPER POWDER, METHOD FOR PRODUCING SILVER-COATED COPPER POWDER, AND RESIN CURING TYPE CONDUCTIVE PASTE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin curing type conductive paste for obtaining a conductive film which is more inexpensive and has a more excellent conductivity than a conductive film formed by using a resin curing type conductive paste obtained by a conventional method, to provide a silver-coated copper powder to be blended in the resin curing type conductive paste, and to provide a method for producing the silver-coated copper powder.SOLUTION: A silver-coated copper powder is obtained by coating a material silver-coated copper powder with 0.01-0.5 mass% of a polycarboxylic acid. The silver coated copper powder is blended in a resin curing type conductive paste.</p> |
申请公布号 |
JP2014208908(A) |
申请公布日期 |
2014.11.06 |
申请号 |
JP20140068091 |
申请日期 |
2014.03.28 |
申请人 |
DOWA ELECTRONICS MATERIALS CO LTD |
发明人 |
YAMADA YUICHI;NAGAHARA AIKO;NOGAMI TOKUAKI;FUJINO TAKEAKI |
分类号 |
B22F1/02;B22F1/00;B22F9/00;H01B1/00;H01B1/22;H01B5/00;H01B13/00 |
主分类号 |
B22F1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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