发明名称 INTEGRATED CIRCUIT WITH BUMP CONNECTION SCHEME
摘要 An integrated circuit includes first and second bump pads spaced from each other with a first space, configured to receive differential signals for a normal operation, and at least one redundant bump pad spaced from the first bump pad with a second space smaller than the first space, configured to receive a signal for a repair to the differential signals.
申请公布号 US2014328130(A1) 申请公布日期 2014.11.06
申请号 US201414338169 申请日期 2014.07.22
申请人 SK hynix Inc. 发明人 LEE Dong-Uk;KIM Young-Ju;SONG Keun-Soo
分类号 H01L23/498;G11C7/22 主分类号 H01L23/498
代理机构 代理人
主权项
地址 Gyeonggi-do KR