Semiconductor Device and Method for Manufacturing Same

摘要

The purpose of the present invention is to increase the reliability of a semiconductor device in which a semiconductor element and a substrate are connected by solder and which is molded by resin.;Solder containing easily volatized metals (Zn, Mg, Sb) is used for a solder material 106, and after a semiconductor element 104 is connected to a lead frame 102 and wire bonding is carried out, vacuum heat treatment is applied, the easily volatized metals in the solder are volatized to adhere to a substrate surface, and an alloy 103 with the lead frame is formed, thereby roughening the substrate surface and improving the adhesive strength of a sealing resin 101 and the substrate.

主权项

1. A method of manufacturing a semiconductor device, comprising:
a connection step of connecting a semiconductor element to a lead using solder; an alloy formation step of volatizing easily volatized metals in a decompressed atmosphere and forming an alloy of the easily volatized metals and metals contained in the lead on a surface of the lead; and a sealing step of sealing the lead provided with the semiconductor element and the alloy by a resin.