发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR MEMORY DEVICE |
摘要 |
According to one embodiment, a manufacturing method of a semiconductor memory device includes forming a stacked body in which word line material layers and insulating layers are alternately stacked on a base layer. The method includes forming first holes on the stacked body so as to be arranged in a first direction and in a second direction that intersects with the first direction. The method includes forming resistance-change films on inner walls of the first holes, forming bit lines inside the resistance-change films in the first holes, and dividing the stacked body in the first direction by forming second holes so that a portion in the stacked body adjacent to the resistance-change films in the second direction. The method includes forming inter-bit line insulating films in the second holes. |
申请公布号 |
US2014326939(A1) |
申请公布日期 |
2014.11.06 |
申请号 |
US201314023865 |
申请日期 |
2013.09.11 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
YAMATO Masaki;Yamaguchi Takeshi;Kobayashi Shigeki |
分类号 |
H01L45/00 |
主分类号 |
H01L45/00 |
代理机构 |
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代理人 |
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主权项 |
1. A manufacturing method of a semiconductor memory device, comprising:
forming a stacked body in which word line material layers and insulating layers are alternately stacked on a base layer; forming first holes on the stacked body so as to be arranged in a first direction and in a second direction that intersects with the first direction; forming resistance-change films on inner walls of the first holes; forming bit lines inside the resistance-change films in the first holes; dividing the stacked body in the first direction by forming second holes so that a portion in the stacked body adjacent to the resistance-change films in the second direction; and forming inter-bit line insulating films in the second holes. |
地址 |
Minato-ku JP |