发明名称 |
PRINTED CIRCUIT BOARDS FABRICATED USING CONGRUENT MOLDS |
摘要 |
Methods for fabricating printed circuit boards, devices for use in the fabrication of printed circuit boards, and structures for a printed circuit board. A mold may be formed as a device that includes a plurality of features, such as recesses, corresponding to a layout of a plurality of conductors for the printed circuit board. A sheet comprised of an electrically-conductive material may be deformed to match the features of the mold. A substrate may then be added to support the sheet, and the sheet may be selectively removed with a mechanical process to define the conductors of the printed circuit board. |
申请公布号 |
US2014326483(A1) |
申请公布日期 |
2014.11.06 |
申请号 |
US201313887807 |
申请日期 |
2013.05.06 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DeVarney Craig N. |
分类号 |
H05K3/04;H05K1/00 |
主分类号 |
H05K3/04 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method of fabricating a printed circuit board, the method comprising:
obtaining a first mold including a plurality of features that correspond to a layout of a plurality of conductors for the printed circuit board; and deforming a sheet comprised of an electrically-conductive material to match the features of the first mold. |
地址 |
Armonk NY US |