发明名称 PRINTED CIRCUIT BOARDS FABRICATED USING CONGRUENT MOLDS
摘要 Methods for fabricating printed circuit boards, devices for use in the fabrication of printed circuit boards, and structures for a printed circuit board. A mold may be formed as a device that includes a plurality of features, such as recesses, corresponding to a layout of a plurality of conductors for the printed circuit board. A sheet comprised of an electrically-conductive material may be deformed to match the features of the mold. A substrate may then be added to support the sheet, and the sheet may be selectively removed with a mechanical process to define the conductors of the printed circuit board.
申请公布号 US2014326483(A1) 申请公布日期 2014.11.06
申请号 US201313887807 申请日期 2013.05.06
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 DeVarney Craig N.
分类号 H05K3/04;H05K1/00 主分类号 H05K3/04
代理机构 代理人
主权项 1. A method of fabricating a printed circuit board, the method comprising: obtaining a first mold including a plurality of features that correspond to a layout of a plurality of conductors for the printed circuit board; and deforming a sheet comprised of an electrically-conductive material to match the features of the first mold.
地址 Armonk NY US