HEAT SINK AND METHOD OF ASSEMBLYING

摘要

A heat sink assembly includes a heat sink configured to be attached to an electronic assembly and to secure at least one component package thereto, a clip configured to be secured to the heat sink and to secure the component package to the heat sink, and at least one fastener to secure the clip to the heat sink. A method for assembling a heat sink assembly includes securing an component package to a heat sink with a clip, and securing the heat sink to an electronic substrate.