| 摘要 |
<p>A sealing sheet formed by adding a peeling liner to a sealing layer is attached to a semiconductor substrate while having heat and pressure applied thereto, the semiconductor substrate is bombarded with X-rays in a state in which the sheet is temporarily press fit, and a transmission image is acquired. On the basis of the transmission image, the presence of voids is detected and the void positions are determined. After each void is pierced with a needle so as to produce a discharge flow path, the sealing sheet again has heat and pressure applied thereto, and the discharge paths are repaired while the voids are removed. If no voids are detected after reinspection, the sealing layer is hardened and fully press fit to the semiconductor substrate.</p> |
