SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME USING SEMICONDUCTOR FIN DENSITY DESIGN RULES

摘要

A method for designing a semiconductor ic chip includes dividing the chip into functional blocks such as a core portion and one or more other functional cells and applying design rules concerning the spatial arrangement of semiconductor fins to the core portion but not to the other functional cells. The design guidelines include the application of design rules to some but not all functional blocks of the chip, may be stored on a computer-readable medium and the design of the semiconductor ic chip and the generation of a photomask set for manufacturing the semiconductor ic chip may be carried out using a CAD or other automated design system. The semiconductor ic chip formed in accordance with this method includes semiconductor fins that are formed in both the core portion and the other functional cells but are only required to be tightly packed in the core portion.

主权项

1. A method of designing and manufacturing a semiconductor integrated circuit chip, said method comprising:
designing a core portion and at least one cell portion of said semiconductor integrated circuit chip to each include semiconductor fins, applying a design rule requiring said semiconductor fins to be arranged in groups, to said core portion but not to said at least one cell portion, and manufacturing said integrated circuit chip in accordance with said design rule such that each said cell portion includes an average device feature density greater than an average device feature density in said core portion, wherein said design rule requires said semiconductor fins in said core portion to be arranged substantially parallel to one another.