ELECTRONIC COMPONENT-EMBEDDED MODULE

摘要

An electronic component-embedded module mountable on a motherboard has a multilayer board wherein a cavity is formed in order to place an electronic component. The multilayer board includes a board-side resin layer with external electrodes for mounting onto the motherboard and board-side via-conductors connected thereto, an intermediate resin layer with intermediate via-conductors connected to the board-side via-conductors, and a component-side resin layer stacked on the intermediate resin layer and having component-side via-conductors. The component-side via-conductors include first component-side via-conductors connected to the intermediate via-conductors and second component-side via-conductors bonded to the electronic component and connected to the first component-side via-conductors. An intermediate volume ratio obtained by dividing a total volume of the intermediate via-conductors by a volume of the intermediate resin layer is less than a component-side volume ratio obtained by dividing a total volume of the component-side via-conductors by a volume of the component-side resin layer.

主权项

1. An electronic component-embedded module mountable on a motherboard, comprising:
a multilayer board in which a cavity is formed; and an electronic component placed in the cavity, wherein the multilayer board includes:
a board-side resin layer with a plurality of external electrodes configured to mount the board-side resin layer onto the motherboard and a plurality of board-side via-conductors electrically connected to the external electrodes;an intermediate resin layer with a plurality of intermediate via-conductors electrically connected to the board-side via-conductors; anda component-side resin layer stacked on the intermediate resin layer and having a plurality of component-side via-conductors provided therein, the component-side via-conductors at least include a plurality of first component-side via-conductors electrically connected to the intermediate via-conductors and a plurality of second component-side via-conductors bonded to the electronic component and electrically connected to the first component-side via-conductors, and
an intermediate volume ratio obtained by dividing a total volume of the intermediate via-conductors by a volume of the intermediate resin layer is less than a component-side volume ratio obtained by dividing a total volume of the component-side via-conductors by a volume of the component-side resin layer.