| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of being downsized and thinned and including a laser marking having excellent shield performance and visibility, and to provide a method for manufacturing the same.SOLUTION: A semiconductor device 10 of an embodiment comprises: a wiring board 2; semiconductor elements 1a to 1i mounted on the wiring board 2; a mold resin 6 sealing the semiconductor elements 1a to 1i; and a shield layer 8 provided on the mold resin 6. The mold resin 6 includes a marking 7 by laser irradiation on a surface thereof. The shield layer 8 is provided on the mold resin 6 including this marking 7. |
