PRESSURE SENSITIVE SHEET FOR PROCESSING SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a pressure sensitive sheet for processing a semiconductor wafer which can be peeled easily after a dicing step in a device for sticking a dicing sheet to a wafer right after grinding of the backside of the wafer, and which allows the attachment of contaminant to be reduced remarkably.SOLUTION: A pressure sensitive sheet 20 for processing a semiconductor wafer comprises: a radiation-permeable base resin film 1; and a pressure sensitive material layer 2 provided on the base resin film. The pressure sensitive material layer is composed of a layer arranged by use of a radiation-curable resin composition. The radiation-curable resin composition includes: 100 pts.mass of a base resin including, as a primary component, a polymer (a) bonding a residue having a (meth)acrylic monomer part having a group including a radiation-curable carbon-carbon double bond to the repeating unit of the main chain; and 0.1-10 pts.mass of a photopolymerization initiator (b) of oligo{2-hydroxy-2-methyl-1-[4-(1-methyl vinyl)phenyl]propanone}(repetition number n=2-3).