COVERLAY FILM FOR ELECTRONIC COMPONENTS, AND COVERLAY FILM FOR PROTECTION FILM-ATTACHED ELECTRONIC COMPONENTS ARRANGED BY USE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a coverlay film for electronic components which can be used as a protection film proper for sealing a module having various components incorporated therein because of being superior in the reliability of moisture resistance, the reliability of a thermal cycle property or the like, and productivity, and which is capable of adequately following a module with small distance between electronic components, and sealing such a module without being torn.SOLUTION: A coverlay film for electronic components comprises: an A layer including 65-90 wt.% of an inorganic filler; and a B layer including 0-50 wt.% of an inorganic filler. The B layer has a breaking ductility of 2400% or larger at 100°C.