发明名称 |
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF |
摘要 |
A package structure is disclosed, which includes a substrate having a body, a plurality of conductive pads formed on the body and a surface passivation layer formed on the body and having a plurality of openings for exposing the conductive pads; a plurality of conductive vias formed in the openings of the surface passivation layer and electrically connected to the conductive pads; a plurality of circuits formed on the surface passivation layer and electrically connected to the conductive vias, wherein the circuits have a plurality of electrical contacts; at least a pattern portion formed on the surface passivation layer and intersecting with the circuits; and a second passivation layer formed on the surface passivation layer, the circuits and the pattern portion and having a plurality of openings for exposing portions of the electrical contacts of the circuits, thereby strengthening the bonding between the circuits and the passivation layers. |
申请公布号 |
US2014327131(A1) |
申请公布日期 |
2014.11.06 |
申请号 |
US201313971237 |
申请日期 |
2013.08.20 |
申请人 |
Siliconware Precision Industries Co., Ltd. |
发明人 |
Yeh Chun-Wei;Shen Chun-Hsien;Li Hsiu-Jung;Lai Ya-Yi;Huang Fu-Tang |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
1. A package structure, comprising:
a substrate, comprising:
a body;a plurality of conductive pads formed on the body; anda surface passivation layer formed on the body and the conductive pads and having a plurality of openings for exposing the conductive pads; a plurality of conductive vias formed in the openings of the surface passivation layer and electrically connected to the conductive pads; a plurality of circuits formed on the surface passivation layer and electrically connected to the conductive vias, wherein the circuits have a plurality of electrical contacts; at least a pattern portion formed on the surface passivation layer and intersecting with the circuits; and a first passivation layer formed on the surface passivation layer, the circuits and the pattern portion and having a plurality of openings for exposing portions of the electrical contacts of the circuits. |
地址 |
Taichung TW |