发明名称 SEMICONDUCTOR STRUCTURE FOR ELECTROMAGNETIC INDUCTION SENSING AND A METHOD OF MANUFACTURING THE SAME
摘要 A semiconductor structure for electromagnetic induction sensing and a method for manufacturing the same are provided: forming the Hall sensor in a first semiconductor fabrication; forming the passivation layer above the Hall sensor to cover the Hall sensor according to the first semiconductor fabrication; and forming the current-carrying layer above the passivation layer in a second semiconductor fabrication to form the semiconductor structure for electromagnetic induction sensing. The current-carrying layer carries the current to be sensed; and the Hall sensor senses the magnetic field generated. The Hall sensor generates a voltage or a current signal proportional to the strength of the current to be sensed.
申请公布号 US2014327094(A1) 申请公布日期 2014.11.06
申请号 US201313966569 申请日期 2013.08.14
申请人 Feeling Technology Corp. 发明人 LIN TENG-TSAI;SU WEN-JUNG;CHEN HSUAN-CHUAN
分类号 H01L43/06;H01L43/14;G01R33/07 主分类号 H01L43/06
代理机构 代理人
主权项 1. A semiconductor structure for electromagnetic induction sensing comprising: at least a Hall sensor sensing a magnetic field generated by a current to be sensed; a passivation layer disposed on the Hall sensor, the passivation layer covering the Hall sensor; and a current-carrying layer disposed on the passivation layer, the current-carrying layer carrying the current to be sensed and being separated from the Hall sensor within an effective distance.
地址 Hsinchu TW