发明名称 |
SEMICONDUCTOR STRUCTURE FOR ELECTROMAGNETIC INDUCTION SENSING AND A METHOD OF MANUFACTURING THE SAME |
摘要 |
A semiconductor structure for electromagnetic induction sensing and a method for manufacturing the same are provided: forming the Hall sensor in a first semiconductor fabrication; forming the passivation layer above the Hall sensor to cover the Hall sensor according to the first semiconductor fabrication; and forming the current-carrying layer above the passivation layer in a second semiconductor fabrication to form the semiconductor structure for electromagnetic induction sensing. The current-carrying layer carries the current to be sensed; and the Hall sensor senses the magnetic field generated. The Hall sensor generates a voltage or a current signal proportional to the strength of the current to be sensed. |
申请公布号 |
US2014327094(A1) |
申请公布日期 |
2014.11.06 |
申请号 |
US201313966569 |
申请日期 |
2013.08.14 |
申请人 |
Feeling Technology Corp. |
发明人 |
LIN TENG-TSAI;SU WEN-JUNG;CHEN HSUAN-CHUAN |
分类号 |
H01L43/06;H01L43/14;G01R33/07 |
主分类号 |
H01L43/06 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor structure for electromagnetic induction sensing comprising:
at least a Hall sensor sensing a magnetic field generated by a current to be sensed; a passivation layer disposed on the Hall sensor, the passivation layer covering the Hall sensor; and a current-carrying layer disposed on the passivation layer, the current-carrying layer carrying the current to be sensed and being separated from the Hall sensor within an effective distance. |
地址 |
Hsinchu TW |