WAFER CHIP FAILURE ANALYSIS SYSTEM EQUIPPED WITH THERMAL CAMERA

摘要

An apparatus for analyzing die failure using a thermal camera is disclosed. The apparatus for analyzing die failure using a thermal camera, of the present invention, comprises: a fixing means for fixing a wafer; a thermal camera for capturing the surface temperature distribution of a die included in the wafer that is fixed on the fixing means; a pair of needles which electrically comes into contact with a pad of the die; a probe manipulator for controlling the position of the needles in response to a user operation; a power drive for applying power to the die via the needles; and a control analyzing means for determining coordinates of a point where the temperature is increased more than a predetermined value from the captured image of the thermal camera for the die with applied power for a predetermined time.