| 发明名称 |
PRINTED CIRCUIT BOARD |
| 摘要 |
A printed circuit board (PCB) comprising a base board, the base board defines a thermal pad and a plurality of pin pads for solder an integrated circuit (IC) with a Quad Flat No-lead (QFN) package, wherein a plurality of thermal vias are defined on the thermal pad through the base board, a solder mask is defined around each of the thermal vias. |
| 申请公布号 |
US2014326486(A1) |
申请公布日期 |
2014.11.06 |
| 申请号 |
US201414265475 |
申请日期 |
2014.04.30 |
| 申请人 |
HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD. ;HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
LAI CHAO-RONG |
| 分类号 |
H05K1/11;H05K1/02 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board (PCB) comprising a base board, the base board comprising a thermal pad and a plurality of pin pads for solder an integrated circuit (IC) with a Quad Flat No-lead (QFN) package, wherein a plurality of thermal vias are defined in the thermal pad through the base board, and a solder mask is defined around each of the thermal vias. |
| 地址 |
Shenzhen CN |
