MONOLITHIC CMOS-MEMS MICROPHONES AND METHOD OF MANUFACTURING
摘要
Systems and methods are disclosed for manufacturing a CMOS-MEMS device (100). A partial protective layer (401) is deposited on a top surface of a layered structure to cover a circuit region. A first partial etch is performed from the bottom side of the layered structure to form a first gap (501) below a MEMS membrane (207) within a MEMS region of the layered structure. A second partial etch is performed from the top side of the layered structure to remove a portion of a sacrificial layer between the MEMS membrane and a MEMS backplate (215) within the MEMS region. The second partial etch releases the MEMS membrane so that it can move in response to pressures. The deposited partial protective layer prevents the second partial etch from etching a portion of the sacrificial layer positioned within the circuit region of the layered structure and also prevents the second partial etch from damaging the CMOS circuit component (211).
申请公布号
WO2014179721(A1)
申请公布日期
2014.11.06
申请号
WO2014US36626
申请日期
2014.05.02
申请人
ROBERT BOSCH GMBH;ZINN, JOHN;DIAMOND, BRETT;HOFFMANN, JOCHEN