| 摘要 |
A manufacturing method of a package carrier is provided. A supporting plate is provided, wherein a metal layer is already disposed on the supporting plate. A patterned dry film layer is formed on the metal layer. A portion of the metal layer is exposed by the patterned dry film layer. The patterned dry film layer is used as an electroplating mask to electroplate a surface treatment layer on the portion of the metal layer exposed by the patterned dry film layer. The patterned dry film layer is removed so as to expose the portion of the metal layer. The surface treatment layer is used as an etching mask to etch the portion of the metal layer not covered by the surface treatment layer so as to form a patterned metal layer. |
