| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To supply a reliable circuit board at low costs. <P>SOLUTION: A substrate 1 is covered with a metal mask 100 so that a partial surface of the substrate 1 including a chip-demountable electrode 2 is exposed via an opening 101, for example. After a metal conductor is formed by an ion plating method for giving a cladding energy of 0.01 to 250 eV to an ionized cladding metal, the metal mask 100 is separated, thus forming a wiring layer 21 that comprises the metal conductor formed on the partial surface of the substrate 1. As a result, the wiring layer 21 can be directly formed on the substrate without using a photolithographic method, thus providing the highly productive and low-cost circuit board. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
