| 摘要 |
A porous organosilica glass film is deposited via a deposition process comprising: introducing into a vacuum chamber gaseous reagents including one precursor of an organosilane or an organosiloxane, and a porogen distinct from the precursor, wherein the porogen is aromatic in nature; applying energy to the gaseous reagents in the chamber to induce reaction of the gaseous reagents to deposit a film, containing the porogen; and removing a portion or substantially all of the organic material by UV radiation to provide the porous film with pores and a dielectric constant less than 2.6. |
