摘要 |
The present application relates to an olefin-based ionomer resin composition, to an encapsulant, and to an optoelectronic device. The resin composition according to the present application may be used as an encapsulant for a variety of optoelectronic devices, and may exhibit superior adhesion to the substrates of the optoelectronic devices. In addition, according to the present application, an olefin-based ionomer resin composition, which can provide good workability and economic advantages in the manufacture of devices without negatively affecting components such as encapsulated optoelectronic elements or the wired electrodes of optoelectronic devices, may be provided. |