发明名称 半導体装置
摘要 PROBLEM TO BE SOLVED: To provide a power semiconductor device which can reduce resistance during conduction while maintaining strength. SOLUTION: The semiconductor device 10 includes: a substrate region 1; a drift region 2, which is arranged on the substrate region 1, is formed of semiconductor material containing silicon carbide, and has a plurality of recessed parts; an anode electrode 3 arranged on a side wall; and a cathode electrode 4 arranged on a side wall so as to face to the anode electrode 3 with the side wall of the recessed part interposed therebetween, and is insulated from the anode electrode 3. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP5621198(B2) 申请公布日期 2014.11.05
申请号 JP20090051048 申请日期 2009.03.04
申请人 发明人
分类号 H01L29/872;H01L29/47;H01L29/861;H01L29/868 主分类号 H01L29/872
代理机构 代理人
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