发明名称 拡張性粘着フィルム、半導体用ダイシングフィルム、及びそれを用いた半導体装置の製造方法
摘要 PROBLEM TO BE SOLVED: To provide a film having both high heat resistance and necking-resistant, high and uniform expansibility. SOLUTION: There is provided an expansible base film comprising a 4-methyl-1-pentene (co)polymer (A) and a thermoplastic elastomer (B), which expansible base film has a content of (B) of 3-50 pts.wt. based on 100 pts.wt. of the total content of (A) and (B) and is characterized in that when it is measured with a differential scanning calorimeter (DSC), the melting point TmB2 ascribable to (B) is 100°C or less or the melting point TmB2 is not observed substantially. COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5620310(B2) 申请公布日期 2014.11.05
申请号 JP20110054766 申请日期 2011.03.11
申请人 发明人
分类号 C09J7/02;B32B27/32;H01L21/301 主分类号 C09J7/02
代理机构 代理人
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