| 摘要 |
An epoxy resin formulation containing a curative, such as a urea based curing agent, which epoxy resin formulation can be cured at 150°C to 95% cure in no more than 150 seconds, and can be cured at 120°C to 95% cure in no more than 4 minutes. This results in a cured resin having a Tg no greater than 140°C wherein the formulation further contains a mould release agent, selected from one or more of alpha linoleic acid, linoleic acid, oleic acid, stearic acid and palmitic acid. Also disclosed is an epoxy resin formulation containing a curative, and a mould release agent, the epoxy resin formulation comprising a phase angle below 30o when cured at 120oC for less than 600 seconds, and when cured at 130oC for less than 350 seconds. Further disclosed, is a prepreg comprising fibrous reinforcement and the epoxy resin formulation and use of the prepreg. |
