| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which shows high hardness, excellent adhesion to base material or backing, good electric characteristics including low permittivity and low dielectric tangent, a high permeability, and particularly a high permeability in the vicinity of a wavelength of 400 nm. <P>SOLUTION: The above-described problem is solved by a photosensitive resin composition which contains a resin (A), a photopolymerization initiator (B), and an antioxidant (C), with the resin (A) containing a resin (A1) prepared by copolymerizing a compound (a1) expressed by formula (1) and another compound (a2) copolymerizable with the compound (a1). <P>COPYRIGHT: (C)2012,JPO&INPIT |
