发明名称 |
Coating-forming liquid composition and coating-forming method therewith |
摘要 |
<p>Provided are: a coating-forming liquid composition capable of forming a coating for bonding copper to a photosensitive resin, which includes an aqueous solution containing an azole having only nitrogen as ring hetero atom, an acid having a logarithm of the reciprocal of acid dissociation constant of 3 to 8 at 25°C, and a salt thereof, has a pH of more than 4 and not more than 7 at 25°C, and can stably form a coating for improving adhesion between copper and a photosensitive resin even when used continuously or repeatedly; and a method of forming a coating for bonding copper to a photosensitive resin, which comprises bringing the surface of the copper into contact with the coating-forming liquid composition to form the coating.</p> |
申请公布号 |
EP2514853(A3) |
申请公布日期 |
2014.11.05 |
申请号 |
EP20120002463 |
申请日期 |
2012.04.05 |
申请人 |
MEC COMPANY LTD. |
发明人 |
SENGOKU, YOICHI;TSUTAE, YOICHI;TAI, KIYOTO;JOKO, KEISUKE;AMATANI, TSUYOSHI |
分类号 |
C23C22/52;C23C18/16;C23C22/68;C23F1/18;H05K3/00;H05K3/10;H05K3/38 |
主分类号 |
C23C22/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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